A big step forward in the manufacture of 3D-printed circuit boards

CORDIS, the European Commission’s primary public repository and portal to disseminate information on all European Union funded research projects, spotted a big step forward in the manufacture of 3D-printed circuit boards thanks to financial and technical support received under the EU-funded SmartEEs2 project. Within SmartEEs2, InnovationLab and its partner, ISRA, have developed a manufacturing process for copper-based solderable circuits. The circuits are screen printed and are compatible with conventional reflow processes. The advantages of producing 3D-printed electronics include the absence of toxic etchants and the ability to complete the process at comparatively low temperatures (about 150 ℃) that significantly reduces energy consumption. The process also helps reduce material consumption – and consequently waste – since the substrates used in additive PCB manufacturing are up to 15 times thinner than those used in conventional processes.

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